Company Filing History:
Years Active: 1987-1998
Title: The Innovations of Richard B Hammer
Introduction
Richard B Hammer is a notable inventor based in Apalachin, NY (US). He has made significant contributions to the field of electronics, holding a total of 5 patents. His work primarily focuses on electronic packaging technologies, which are crucial for the advancement of modern electronic devices.
Latest Patents
One of Richard B Hammer's latest patents is an electronic package with a thermally conductive support member. This innovative electronic package includes a rigid support member, such as a copper sheet, to which both the semiconductor chip and circuitized substrate members are bonded. The chip is attached using a thermally conductive adhesive, while the circuitized substrate, preferably a flexible circuit, is bonded with an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, typically by wire, thermocompression, or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package can also be electrically coupled to a separate, second substrate, such as a PCB.
Career Highlights
Richard B Hammer has had a distinguished career, working at the International Business Machines Corporation (IBM). His expertise in electronic packaging has positioned him as a key player in the development of advanced electronic solutions. His contributions have not only enhanced the performance of electronic devices but have also paved the way for future innovations in the industry.
Collaborations
Throughout his career, Richard has collaborated with several talented individuals, including Frank E Andros and James Russell Bupp. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in electronic packaging.
Conclusion
Richard B Hammer's work exemplifies the spirit of innovation in the field of electronics. His patents and contributions continue to influence the industry, showcasing the importance of advanced electronic packaging solutions. His legacy as an inventor is marked by his commitment to enhancing technology for future generations.