International Business Machines Corporation

Richard B Hammer

James Russell Bupp

Frank E Andros

Michael DiPietro

James V Ellerson

Keith A Snyder

William A Donson

William Lafer

An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

Electronic package with thermally conductive support member having a

Method of making an electronic package with a thermally conductive

A process for providing circuit lines on a substrate having a non-planar surface is provided. The process includes applying a layer of photoresist material to the substrate, selectively screen printing on non-planar areas of the substrate a screen-printable coating, photoprocessing the layer of photoresist material, and providing electrical conductive pattern on the substrate.

Providing circuit lines on a substrate

Growing community of inventors

Apalachin, NY, United States of America

Richard B Hammer