This inventor holds 1 USPTO granted patent. Top assignee: Oracle America, Inc.. Active years: 2010.
Company Filing History:
Years Active: 2010
Title: Richard A. Raffel: Innovator in Modular I/O Expansion Technology
Introduction
Richard A. Raffel is a notable inventor based in Menlo Park, California. He has made significant contributions to the field of technology, particularly in the area of modular I/O expansion devices. His innovative approach has led to the development of a unique patent that enhances connectivity in electronic devices.
Latest Patents
Richard A. Raffel holds a patent for a device titled "Multi-interface multi-channel modular hot plug I/O expansion." This invention features a connector with first and second signal pins that establish connections in a specific sequence. The device is designed to identify multiple pre-determined signal patterns from a mating connector, allowing it to interface with various devices according to different interface protocols. This technology is crucial for improving the efficiency and reliability of electronic connections.
Career Highlights
Richard A. Raffel is currently employed at Oracle America, Inc., where he continues to work on innovative solutions in technology. His expertise in modular I/O systems has positioned him as a valuable asset to his team and the company as a whole.
Collaborations
Throughout his career, Richard has collaborated with talented individuals such as Wenjun Chen and Martin S. Mok. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Richard A. Raffel's contributions to the field of modular I/O expansion technology exemplify his innovative spirit and dedication to advancing electronic connectivity. His work continues to influence the industry and inspire future inventions.