Richard A Nagy

Title: The Innovations of Richard A. Nagy

Introduction

Richard A. Nagy is a notable inventor based in Leucadia, California. He has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. His work has advanced the technology used in electronic devices, showcasing his expertise and innovative spirit.

Latest Patents

Nagy's latest patents include a method for fabricating an integrated circuit package using a thermoplastic plug. This innovative approach involves assembling a stack of thin flat epoxy-glass layers, with adhesive layers in between. The design features a staircase-shaped cavity that extends from an outer epoxy-glass layer to an internal one. Conductors are placed on the internal layer, including bonding pads. The thermoplastic plug fits snugly into the cavity, allowing for precise lamination that prevents adhesive from flowing onto the bonding pads. Another patent focuses on an epoxy-glass integrated circuit package with bonding pads arranged in a stepped configuration, further enhancing the functionality of electronic components.

Career Highlights

Throughout his career, Richard A. Nagy has worked with prominent companies such as Burroughs, Inc. and Unisys Corporation. His experience in these organizations has contributed to his development as an inventor and has provided him with a platform to innovate in the field of electronics.

Collaborations

Nagy has collaborated with notable coworkers, including Norman E. McNeal and Ronald Allen Norell. These partnerships have likely fostered a creative environment that has led to the development of his patents and innovations.

Conclusion

Richard A. Nagy is a distinguished inventor whose work in integrated circuit packaging has made a lasting impact on the electronics industry. His innovative methods and collaborations highlight his significant contributions to technology.