Unisys Corporation

Burroughs, Inc.

Richard A Nagy

Norman E McNeal

Ronald Allen Norell

An integrated circuit package is fabricated by assembling a stack which is comprised of a plurality of thin flat epoxy-glass layers, adhesive layers between the epoxy-glass layers, and a staircase-shaped cavity. This cavity extends from an outer epoxy-glass layer to an internal epoxy-glass layer and goes parallel along a portion of the flat surface of the internal epoxy-glass layer and then penetrates through it. Conductors lie on the internal epoxy-glass layer, including bonding pads on the flat surface portions. After the stack is assembled, a plug is inserted into its cavity. This plug is thermoplastic; and it fits snugly into the cavity and extends over a larger area outside the cavity. While the plug is in the cavity, the stack is laminated at a temperature and pressure which causes the plug to soften and conform to the exact shape of the cavity. This dams the adhesive from flowing onto the bonding pads.

Thermoplastic plug method of fabricating an integrated circuit package

An integrated circuit package comprises a plurality of thin flat epoxy-glass layers which are arranged in a stack and are laminated together by prepreg layers that lie between the epoxy-glass layers. This stack has a cavity which is staircase-shaped and extends from an outer epoxy-glass layer to an internal epoxy-glass layer, goes parallel along the internal epoxy-glass layer and then penetrates through it. Patterned electrical conductors lie on the flat surface of the internal epoxy-glass layer, including wire bonding pads on its exposed flat surface portion.

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Leucadia, CA, United States of America

Richard A Nagy