Greensboro, NC, United States of America

Richard A Gassman

This inventor holds 1 USPTO granted patent. Top assignee: Sandia Corporation. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard A Gassman. Retrieved from https://idiyas.com/inventor/richard-a-gassman

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 248(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Richard A. Gassman: Innovator in Silicon Chip Technology

Introduction

Richard A. Gassman is a notable inventor based in Greensboro, NC (US). He has made significant contributions to the field of integrated circuit technology, particularly through his innovative patent related to silicon ball grid array chip carriers. His work has implications for the future of semiconductor design and functionality.

Latest Patents

Gassman's most recent patent is for a silicon ball grid array chip carrier. This invention involves a ball-grid-array integrated circuit (IC) chip carrier formed from a silicon substrate. The design is particularly useful for ICs with peripheral bond pads that can be reconfigured to a ball-grid-array. The use of silicon allows for the chip carrier to be fabricated on an IC process line using standard IC processes. Additionally, the silicon chip carrier can incorporate components such as transistors, resistors, capacitors, inductors, and sensors, creating a 'smart' chip carrier that enhances functionality and testability for ICs mounted on it. The 'smart' chip carrier can provide various functionalities, including boundary-scan cells, built-in test structures, signal conditioning circuitry, and power conditioning circuitry. It can also facilitate the formation of specialized or application-specific ICs (ASICs) from conventional ICs. The sensors that can be included range from temperature and pressure sensors to inertia and chemical sensors, all of which can be fabricated using IC processes.

Career Highlights

Richard A. Gassman is currently employed at Sandia Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing the capabilities of integrated circuits, particularly in the area of smart chip carriers.

Collaborations

Gassman has collaborated with notable colleagues such as David W. Palmer and Dahwey Chu, contributing to a dynamic work environment that fosters innovation and technological advancement.

Conclusion

Richard A. Gassman is a pioneering inventor whose work in silicon chip technology has the potential to reshape the landscape of integrated circuits. His contributions, particularly through his patent for a silicon ball grid array chip carrier, highlight the importance of innovation in the semiconductor industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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