Richard A Boronosky

Title: Biography of Inventor Richard A Boronosky

Introduction: Richard A Boronosky is a notable inventor based in Thomaston, Connecticut. He has made significant contributions to the field of semiconductor packaging. His innovative approach has led to the development of a patented technology that enhances the reliability and performance of solid-state electrical components.

Latest Patents: Richard holds a patent for the "Packaging of a semiconductor." This invention involves a solid-state electrical component that is packaged within a housing. After being connected to a terminal board, the component is potted by an encapsulating medium. The design includes a chip area and multiple terminals connected to the chip, which are then linked to a terminal board that supports additional terminal members extending from the housing. This setup is designed for connection in an electrical circuit, with the housing and device supported by a frame that serves as a heat sink.

Career Highlights: Richard A Boronosky has worked with General Time Corporation, where he has applied his expertise in semiconductor technology. His work has been instrumental in advancing the company's capabilities in producing reliable electronic components.

Collaborations: Throughout his career, Richard has collaborated with fellow inventor George Joseph Yagusic. Their partnership has contributed to the development of innovative solutions in the field of electronics.

Conclusion: Richard A Boronosky's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in engineering. His patented technology