San Francisco, CA, United States of America

Ricardo Figueiroa Monteiro

This inventor holds 4 USPTO granted patents. Top assignee: Microsoft Technology Licensing, LLC. Active years: 2015-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ricardo Figueiroa Monteiro. Retrieved from https://idiyas.com/inventor/ricardo-figueiroa-monteiro

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 33(Granted Patents)


Company Filing History:


Years Active: 2015-2016

Loading Chart...
4 patents (USPTO):Explore Patents

Title: The Innovative Journey of Ricardo Figueiroa Monteiro

Introduction

Ricardo Figueiroa Monteiro is a prominent inventor based in San Francisco, CA. He has made significant contributions to the field of technology, particularly in packaging solutions. With a total of 4 patents to his name, Monteiro continues to push the boundaries of innovation.

Latest Patents

Monteiro's latest patents focus on advancements in packaging. These innovations aim to improve efficiency and sustainability in packaging processes, reflecting his commitment to addressing modern challenges in the industry.

Career Highlights

Currently, Monteiro is associated with Microsoft Technology Licensing, LLC. His role at this leading technology company allows him to leverage his expertise in developing cutting-edge solutions that meet the needs of consumers and businesses alike.

Collaborations

Throughout his career, Monteiro has collaborated with talented individuals such as Vivian Kate Barad and Scott Tong. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of innovative products.

Conclusion

Ricardo Figueiroa Monteiro's contributions to the field of packaging and technology exemplify his dedication to innovation. His work continues to inspire others in the industry, making a lasting impact on the future of packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…