Endicott, NY, United States of America

Ricahrd A Schumacher

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1990.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ricahrd A Schumacher. Retrieved from https://idiyas.com/inventor/ricahrd-a-schumacher

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 1990

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1 patent (USPTO):Explore Patents

Title: The Innovations of Richard A. Schumacher

Introduction

Richard A. Schumacher is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of thermal conductivity through his innovative patent. His work is recognized within the industry, particularly at his employer, International Business Machines Corporation (IBM).

Latest Patents

Richard holds a patent for an "Epoxy composition of increased thermal conductivity and use thereof." This composition features a tetrabrominated diglycidyl ether polyepoxide, an epoxy polymer with an epoxy functionality of 3.5 to 6, zinc oxide, and curing agents. This invention aims to enhance thermal conductivity, which is crucial for various applications in technology and manufacturing.

Career Highlights

Throughout his career at IBM, Richard has focused on developing materials that improve the performance of electronic devices. His expertise in epoxy compositions has positioned him as a valuable asset in the research and development sector of the company.

Collaborations

Richard has worked alongside talented colleagues, including Christina Marie Boyko and Craig Neal Johnston. Their collaborative efforts have contributed to advancements in material science and engineering.

Conclusion

Richard A. Schumacher's innovative work in epoxy compositions demonstrates his commitment to enhancing thermal conductivity in technology. His contributions continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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