Clarkston, MI, United States of America

Riad Chaaya

This inventor holds 10 USPTO granted patents and 10 published patent applications, plus 1 CIPO patent and 9 EPO patents. Top assignee: Magna Exteriors Gmbh. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Riad Chaaya. Retrieved from https://idiyas.com/inventor/riad-chaaya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10 

% Patents Active = 90.0

 

 

Average Co-Inventor Count = 5.2

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2018-2026

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10 patents (USPTO):Explore Patents

Title: Riad Chaaya: Innovator in Overmolding Technology

Introduction

Riad Chaaya is a prominent inventor based in Clarkston, MI (US), known for his innovative contributions to the field of overmolding technology. With a total of 10 patents to his name, Chaaya has made significant strides in enhancing manufacturing processes and structural integrity in various applications.

Latest Patents

Chaaya's latest patents include groundbreaking advancements in metal rib overmolding joining and three-dimensional overmolding. The first patent focuses on creating geometrical features in reinforcements that interconnect a three-dimensional metal reinforcement to a metal base plate of an overmolding part. This innovative approach allows for the transfer of load forces without the need for welding processes. The second patent introduces a three-dimensional overmolding process that meets predetermined structural requirements while minimizing mass and cost. This technology provides significant performance benefits by combining the advantages of three-dimensional shapes with the overmolding process.

Career Highlights

Riad Chaaya is currently employed at Magna Exteriors GmbH, where he continues to develop and refine his innovative ideas. His work has not only contributed to the company's success but has also positioned him as a leader in the field of overmolding technology.

Collaborations

Chaaya has collaborated with notable colleagues, including Christopher John Kuntze and Mark Peter Birka, to further enhance the development of overmolding technologies. Their combined expertise has led to significant advancements in the industry.

Conclusion

Riad Chaaya's contributions to overmolding technology exemplify the spirit of innovation and dedication to improving manufacturing processes. His patents and collaborative efforts continue to shape the future of this field, making him a noteworthy figure in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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