Company Filing History:
Years Active: 2013
Title: Renshan Zhang: Innovator in Integrated Circuit Packaging
Introduction
Renshan Zhang is a notable inventor based in Sunnyvale, California. He has made significant contributions to the field of integrated circuit packaging. His innovative designs aim to enhance the efficiency and functionality of electronic devices.
Latest Patents
Renshan Zhang holds a patent for a two-shelf interconnect. This patent describes a package that includes a housing with a recessed portion designed to accommodate an integrated circuit or chip. The housing features an inner periphery that defines the recessed portion, which may include stepped surfaces that create first and second shelves. The design allows for effective electrical connections between housing pads and integrated circuit pads, optimizing the layout and spacing of these components. He has 1 patent to his name.
Career Highlights
Renshan Zhang is currently employed at Infinera Corporation, where he continues to work on innovative solutions in the field of electronics. His expertise in integrated circuit design has positioned him as a valuable asset to his team and the company.
Collaborations
Throughout his career, Renshan has collaborated with talented individuals such as Donald J Pavinski and Jiaming Zhang. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Renshan Zhang's contributions to integrated circuit packaging exemplify the spirit of innovation in the technology sector. His work continues to influence the design and functionality of electronic devices, showcasing the importance of inventive thinking in advancing technology.