Renlan Shi

Title: Renlan Shi: Innovator in Low-Dielectric Resin Technology

Introduction

Renlan Shi is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of materials science, particularly in the development of low-dielectric resin compositions. His innovative work has implications for various electronic applications.

Latest Patents

Renlan Shi holds a patent for a low-dielectric resin composition, low-dielectric resin/metal composite material, and the preparation method thereof, along with electronic equipment. This resin composition comprises, based on 100% by weight of the resin composition: 45-70 wt % of a main resin, 20-45 wt % of a chopped glass fiber, 1-3 wt % of a toughening resin, 0.2-0.5 wt % of an unmodified glycidyl methacrylate, and 0-10 wt % of auxiliaries. The main resin is selected from at least one of PBT resin and PPS resin. The chopped glass fiber has a dielectric constant of 4.0 to 4.4 at 1 MHz. This innovation is crucial for enhancing the performance of electronic devices.

Career Highlights

Renlan Shi is currently associated with Byd Company Limited, where he continues to push the boundaries of material innovation. His work has garnered attention in the industry, showcasing his expertise in resin technology.

Collaborations

Renlan has collaborated with notable colleagues, including Qing Gong and Wei Wei, who contribute to his research and development efforts. Their teamwork enhances the innovative potential of their projects.

Conclusion

Renlan Shi's contributions to low-dielectric resin technology exemplify the importance of innovation in materials science. His patent and ongoing work at Byd Company Limited highlight his role as a key inventor in this field.