Hsinchu, Taiwan

Ren-Jeng Wang

This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Point Robotics Medtech Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ren-Jeng Wang. Retrieved from https://idiyas.com/inventor/ren-jeng-wang-2o1342kb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ren-Jeng Wang and His Endoscope Innovation.

Introduction

Ren-Jeng Wang is an inventor associated with Hsinchu, Taiwan, and Point Robotics Medtech Inc. His patent work includes an invention for an endoscope sleeve assembly designed to support the positioning and rotation of a lens assembly.

Latest Patents

Wang is credited with 1 patent: “Sleeve Assembly and Endoscope Device.” The invention describes an endoscope device comprising a lens assembly and a sleeve assembly. The sleeve assembly has an outer sleeve with two communicating openings and a detachable inner sleeve. An annular component surrounds the outer sleeve, while the inner sleeve fits closely against its inner wall and can rotate around the sleeve’s central axis. The lens assembly is positioned inside the inner sleeve.

Career Highlights

Wang’s listed patent reflects work on components for endoscopic devices, particularly a sleeve structure that allows the inner sleeve and lens assembly to rotate relative to the outer sleeve. He is associated with Point Robotics Medtech Inc.

Collaborations

The available information connects Wang’s patent activity with Point Robotics Medtech Inc. It does not specify additional collaborators or co-inventors.

Conclusion

Ren-Jeng Wang’s patent describes a detachable, rotatable sleeve assembly for an endoscope, highlighting his contribution to medical-device innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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