Columbus, OH, United States of America

Rejeev Tirumala Pakalapati

This inventor holds 1 USPTO granted patent. Top assignee: Diamond Innovations. Inc.. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rejeev Tirumala Pakalapati. Retrieved from https://idiyas.com/inventor/rejeev-tirumala-pakalapati

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2011

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Rejeev Tirumala Pakalapati: Innovator in Tool Materials

Introduction

Rejeev Tirumala Pakalapati is an accomplished inventor based in Columbus, OH (US). He has made significant contributions to the field of tool materials, particularly through his innovative patent.

Latest Patents

Rejeev holds a patent for a sintered compact, specifically a sintered cubic boron nitride (cBN) compact designed for use in tools. This invention is obtained by sintering a mixture that includes cubic boron nitride, aluminum oxide, one or more refractory metal compounds, and aluminum and/or one or more non-oxide aluminum compounds. The resulting sintered bodies exhibit sufficient strength and toughness, making them suitable for heavy machining of cast irons.

Career Highlights

Rejeev is currently employed at Diamond Innovations, Inc., where he continues to develop advanced materials for industrial applications. His work focuses on enhancing the performance and durability of cutting tools.

Collaborations

Rejeev collaborates with his coworker, James Michael McHale, to further innovate in the field of tool materials.

Conclusion

Rejeev Tirumala Pakalapati's contributions to the development of sintered tool materials highlight his role as a key innovator in the industry. His patent reflects a commitment to advancing technology in heavy machining applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…