Unterschweinbach, Germany

Reinhard Wittmann

This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Ag. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Reinhard Wittmann. Retrieved from https://idiyas.com/inventor/reinhard-wittmann

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Reinhard Wittmann and Micro-Mechanical Component Manufacturing.

Introduction

Reinhard Wittmann is an inventor associated with Unterschweinbach, Germany, and Infineon Technologies AG. His patent work addresses a manufacturing method for micro-mechanical components.

Latest Patents

Wittmann is credited with 1 patent, titled “Method for the Manufacture of Micro-Mechanical Components.” The invention describes producing components from a layered stack that includes a substrate, a sacrificial layer, and a layer intended to be undercut. It uses etch holes and a passivation layer to control the selective deposition of cover material after the sacrificial layer is etched. This approach helps prevent the undercut elements from becoming excessively thick or joining with the substrate.

Career Highlights

The available information connects Wittmann’s invention to Infineon Technologies AG and highlights his contribution to micro-mechanical manufacturing processes.

Collaborations

Martin Franosch and Catharina Pusch are identified as Wittmann’s coworkers. The supplied information does not specify their roles in the patent.

Conclusion

Reinhard Wittmann’s patent describes a controlled approach to forming micro-mechanical components, with passivation helping manage the deposition process and preserve the intended structure.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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