Ii Asema, Sweden

Reijo Vapa

This inventor holds 1 USPTO granted patent. Top assignee: Stora Enso Oyj. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Reijo Vapa. Retrieved from https://idiyas.com/inventor/reijo-vapa-uvglvids

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Reijo Vapa: Innovator in Lightweight Packaging Solutions

Introduction

Reijo Vapa is a notable inventor based in Ii Asema, Sweden. He has made significant contributions to the field of packaging materials, particularly with his innovative approach to corrugated packaging. His work focuses on creating solutions that are both lightweight and environmentally friendly.

Latest Patents

Reijo Vapa holds 1 patent for his invention of a lightweight corrugated packaging material. This invention discloses a corrugated packaging material that possesses low weight and high strength properties. Importantly, the material can be recycled with the office paper recycling stream. The corrugated packaging material exhibits good strength and stiffness properties, a low washboard tendency, and provides an excellent printing surface.

Career Highlights

Reijo Vapa is associated with Stora Enso Oyj, a leading company in renewable materials. His work at Stora Enso has allowed him to focus on developing sustainable packaging solutions that meet the demands of modern consumers and businesses.

Collaborations

Throughout his career, Reijo has collaborated with talented individuals such as Irene Wedin and Dan Persson Norgren. These collaborations have contributed to the advancement of innovative packaging technologies.

Conclusion

Reijo Vapa's contributions to lightweight packaging solutions highlight his commitment to innovation and sustainability. His work not only enhances the efficiency of packaging materials but also supports environmental conservation efforts.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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