Osaka, Japan

Reiichi Konishi

This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Nakamoto Packs Co., Ltd.. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Reiichi Konishi. Retrieved from https://idiyas.com/inventor/reiichi-konishi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Reiichi Konishi - Innovator in Food Container Manufacturing

Introduction

Reiichi Konishi is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of food packaging through his innovative methods. His work focuses on enhancing the manufacturing processes for food containers, which is crucial for the food industry.

Latest Patents

Reiichi Konishi holds a patent for a "Method of manufacturing sheet for food containers." This invention relates to a method that improves the production of sheets used in food containers, ensuring better quality and efficiency in manufacturing.

Career Highlights

Konishi is associated with Nakamoto Packs Co., Ltd., a company that specializes in packaging solutions. His role at the company allows him to apply his inventive skills to real-world applications, contributing to advancements in food packaging technology.

Collaborations

He has worked alongside his coworker, Katsuro Sasauchi, to further develop innovative solutions in the packaging industry. Their collaboration has led to improvements in manufacturing techniques and product quality.

Conclusion

Reiichi Konishi's contributions to the field of food container manufacturing highlight the importance of innovation in packaging technology. His patent and work at Nakamoto Packs Co., Ltd. demonstrate his commitment to enhancing the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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