Phoenix, AZ, United States of America

Reginald K Asher, Ii

This inventor holds 1 USPTO granted patent. Top assignee: Motorola Corporation. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Reginald K Asher, Ii. Retrieved from https://idiyas.com/inventor/reginald-k-asher-ii

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: Reginald K. Asher II and Semiconductor Packaging Innovation.

Introduction

Reginald K. Asher II is an inventor associated with Phoenix, Arizona, and Motorola Corporation. His patent work addresses semiconductor packaging, with a focus on improving the protective coating applied to a component’s leadframe.

Latest Patents

Asher is credited with 1 patent: “Method of Manufacturing Semiconductor Component.” The invention describes a polymeric organic coating designed to increase voltage isolation, reduce thermal resistance, and improve scratch and abrasion resistance.

The coating is applied to the semiconductor component’s leadframe through a chemical grafting process involving monomers, prepolymers, a catalyst, a graft initiator, and other ingredients. The process forms a polymeric film chemically bonded to the leadframe, strengthening adhesion between the coating and the underlying surface.

Career Highlights

Asher’s documented patent contribution concerns semiconductor manufacturing and packaging. The invention’s chemical grafting approach aims to improve the durability and performance of a semiconductor component’s protective coating.

Collaborations

Asher’s listed coworkers include James Price Letterman Jr. and Felicia B. Dragnea. The available information identifies these professional associations but does not specify their roles in the patent.

Conclusion

Reginald K. Asher II’s patent describes a chemically bonded coating intended to enhance the electrical isolation, thermal performance, and surface durability of semiconductor components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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