Mundelein, IL, United States of America

Reena Fernandes

This inventor holds 4 USPTO granted patents. Top assignee: Medline Industries, Inc.. Active years: 2018-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Reena Fernandes. Retrieved from https://idiyas.com/inventor/reena-fernandes

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 87(Granted Patents)


Company Filing History:


Years Active: 2018-2023

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4 patents (USPTO):Explore Patents

Title: The Innovative Journey of Reena Fernandes

Introduction

Reena Fernandes is a talented inventor based in Mundelein, IL (US). She has made significant contributions to her field, holding a total of 4 patents. Her work primarily focuses on innovative packaging solutions, showcasing her creativity and technical expertise.

Latest Patents

Among her latest patents is a unique packaging blank that has garnered attention for its efficiency and design. This invention reflects her commitment to improving packaging processes and enhancing product safety.

Career Highlights

Reena is currently employed at Medline Industries, Inc., where she continues to develop innovative solutions. Her role at the company allows her to collaborate with other professionals and contribute to the advancement of medical packaging technologies.

Collaborations

Throughout her career, Reena has worked alongside notable colleagues such as Mark Vanderhulst and Jerome Shurell. These collaborations have enriched her experience and expanded her innovative capabilities.

Conclusion

Reena Fernandes exemplifies the spirit of innovation through her patents and contributions to the packaging industry. Her work at Medline Industries, Inc. and collaborations with esteemed colleagues highlight her dedication to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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