Rochester, NY, United States of America

Raymond S Eachus

This inventor holds 7 USPTO granted patents. Top assignee: Eastman-Kodak Company. Active years: 1989-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Raymond S Eachus. Retrieved from https://idiyas.com/inventor/raymond-s-eachus

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 85.7

Average Co-Inventor Count = 4.3

ph-index = 5

Forward Citations = 112(Granted Patents)


Company Filing History:


Years Active: 1989-2003

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7 patents (USPTO):Explore Patents

Title: Inventor Spotlight: Raymond S Eachus - Innovating the Photography Industry

Introduction: Raymond S Eachus, a prolific inventor based in Rochester, NY, has left a significant mark on the photography industry with his innovative patents. With seven patents to his name, his contributions have revolutionized the way we capture and develop photographs.

Latest Patents:

1. High chloride emulsion doped with a combination of metal complexes.

2. Silver halide emulsions with doped epitaxy.

Career Highlights: Raymond S Eachus is currently affiliated with Eastman-Kodak Company, a renowned player in the imaging technology sector. His expertise and creativity have helped propel the company's product development efforts, leading to groundbreaking advancements in photography.

Collaborations: Along his journey, Raymond S Eachus has collaborated with esteemed professionals in the field, including Woodrow G McDugle, Jr and Myra T Olm. Together, they have worked on projects that have pushed the boundaries of traditional photography techniques and materials.

Conclusion: Raymond S Eachus's dedication to innovation and his profound understanding of imaging technology have positioned him as a trailblazer in the photography industry. His patents continue to inspire new generations of inventors and shape the future of visual storytelling.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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