Company Filing History:
Years Active: 1984-1996
Title: Innovations of Raymond R Ruckel
Introduction
Raymond R Ruckel is a notable inventor based in Garrison, NY (US). He has made significant contributions to the field of electrostatic chucks, particularly in semiconductor processing. With a total of 9 patents to his name, Ruckel's work has had a profound impact on the technology used in wafer support systems.
Latest Patents
Ruckel's latest patents include a method of making an electrostatic chuck with an oxide insulator. This innovative method involves machining component parts, anodizing them to create a hard insulating surface, and assembling them in a fixture. This process results in a planar surface for wafer support that retains superior insulating properties. Additionally, he has developed an electrostatic chuck characterized by varying thickness areas, which allows for a finely uniform thickness of dielectric material on the chuck surface. This design ensures a closely determined magnitude of electrostatic holding force, enhancing the efficiency of semiconductor wafer processing.
Career Highlights
Ruckel has spent a significant portion of his career at International Business Machines Corporation (IBM). His work has been instrumental in advancing the technology behind electrostatic chucks, which are critical in the semiconductor manufacturing process. His innovative approaches have led to improvements in the performance and reliability of these devices.
Collaborations
Throughout his career, Ruckel has collaborated with esteemed colleagues such as Robert E Tompkins and Robert P Westerfield, Jr. These collaborations have fostered a creative environment that has led to numerous advancements in their field.
Conclusion
Raymond R Ruckel's contributions to the field of electrostatic chucks have established him as a prominent inventor in semiconductor technology. His innovative patents and collaborative efforts continue to influence the industry today.
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