Kennewick, WA, United States of America

Raymond M Erbeznik

This inventor holds 1 USPTO granted patent. Top assignee: Infinia Corporation. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Raymond M Erbeznik. Retrieved from https://idiyas.com/inventor/raymond-m-erbeznik

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: The Innovations of Raymond M. Erbeznik

Introduction

Raymond M. Erbeznik is a notable inventor based in Kennewick, WA (US). He has made significant contributions to the field of thermal regenerative machines. His innovative approach has led to the development of a unique patent that addresses critical issues in this technology.

Latest Patents

Raymond holds a patent for a "Reduced shedding regenerator and method." This invention focuses on minimizing the shedding of particles from regenerator surfaces. By alleviating potential sources of damage and malfunction, his work enhances the reliability of thermal regenerative machines.

Career Highlights

Raymond is associated with Infinia Corporation, where he applies his expertise in engineering and innovation. His work at the company has been instrumental in advancing technologies that improve energy efficiency and performance.

Collaborations

Raymond has collaborated with talented individuals such as Songgang Qiu and John Edward Augenblick. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Raymond M. Erbeznik's contributions to the field of thermal regenerative machines exemplify the impact of innovative thinking in engineering. His patent and collaborative efforts continue to influence advancements in this area.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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