Company Filing History:
Years Active: 2025
Title: Raymond J Recchia: Innovator in Multiwall Paper Packaging Structures
Introduction: Raymond J Recchia, an accomplished inventor based in Cincinnati, OH, has made significant contributions to the field of packaging technology. With a focus on innovative solutions, he holds a patent for a multiwall paper packaging structure that enhances the durability and functionality of packaging articles. His work exemplifies the drive for innovation in material engineering.
Latest Patents: Raymond J Recchia's notable patent is for a multiwall paper packaging structure. This design includes an outer, intermediate, and inner set of paper plies, which are carefully layered and adhered using two distinct adhesive layers. The innovative aspect of this design is the coalignment of the adhesive layers, which optimizes the adhesion process while ensuring that the adhesive spots from the different layers do not overlap with one another. This thoughtful construction results in a robust, multiwall structure suited for various packaging applications.
Career Highlights: Currently employed by ProAmpac Holdings Inc., Raymond has dedicated his career to advancing packaging solutions. His work not only focuses on practicalities but also on the sustainable aspects of packaging materials, reflecting a growing trend in the industry toward eco-friendly innovations.
Collaborations: Throughout his career, Raymond J Recchia has collaborated with fellow professionals such as Russell A Leeker and Brian J Schiermeier. These partnerships have enabled the sharing of ideas and innovations, fostering an environment that encourages the development of cutting-edge packaging technologies.
Conclusion: Raymond J Recchia’s contributions to multiwall paper packaging structures illustrate the importance of innovation in the packaging industry. His patented work stands as a testament to his creativity and commitment to improvement in materials and processes. As he continues to innovate at ProAmpac Holdings Inc., the impacts of his inventions are likely to resonate throughout the packaging sector, inspiring future developments in this vital field.