Fremont, WI, United States of America

Raymond G Buchko, Jr

This inventor holds 3 USPTO granted patents and 1 EPO patent. Top assignee: Cp Packaging, Inc.. Active years: 2020-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Raymond G Buchko, Jr. Retrieved from https://idiyas.com/inventor/raymond-g-buchko-jr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020-2024

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3 patents (USPTO):Explore Patents

Title: Innovations by Raymond G Buchko, Jr.

Introduction

Raymond G Buchko, Jr. is an accomplished inventor based in Fremont, WI (US). He has made significant contributions to the field of industrial machinery with a total of 3 patents to his name. His innovative designs focus on enhancing the efficiency and functionality of machine components.

Latest Patents

One of his latest patents is a "System for automatic calibration of an initial position of a moveable machine component." This system is designed to automatically calibrate or define a home or initial position of a moveable component in industrial machines. The calibration procedure involves operating an actuator in a low-speed and low-torque mode until the component contacts a mechanical stop. This creates a stall condition that the control system monitors to define the component's position accurately.

Another notable patent is the "Simplified lift mechanism for a packaging machine." This invention simplifies the process of raising and lowering machine components. It features a base and frame structure with a lift arrangement that allows for vertical motion about a single lift point. The mechanism translates rotational movement from a motor into linear vertical motion, enhancing the operational efficiency of packaging machines.

Career Highlights

Raymond G Buchko, Jr. is currently employed at Cp Packaging, Inc., where he continues to innovate and develop new technologies. His work has significantly impacted the efficiency of packaging processes, making him a valuable asset to his company.

Collaborations

Raymond collaborates with his coworker, Rodney W Golla, to further enhance their innovative projects and drive advancements in their field.

Conclusion

Raymond G Buchko, Jr. exemplifies the spirit of innovation in industrial machinery through his patents and contributions at Cp Packaging, Inc. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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