Austin, TX, United States of America

Raymond E Prime

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1991.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Raymond E Prime. Retrieved from https://idiyas.com/inventor/raymond-e-prime

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 1991

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovations of Raymond E. Prime

Introduction

Raymond E. Prime is a notable inventor based in Austin, TX, recognized for his contributions to the field of soldering technology. With a focus on enhancing the efficiency of solder application, he has developed innovative solutions that have impacted the electronics manufacturing industry.

Latest Patents

One of Raymond E. Prime's significant inventions is a solder placement nozzle assembly. This nozzle assembly is designed for depositing solder onto a series of conductive surfaces, such as the mounting pads of a surface mount integrated circuit board. The assembly features an upper nozzle mount and a removable nozzle head, which includes an interior bore for receiving a portion of the nozzle mount and an elongate heat source. The nozzle head is equipped with an orifice for receiving solid solder, which is fed within the interior bore to contact the elongate heat source. The interior bore terminates in a solder reservoir for molten solder, which is dispensed through a tip opening to deposit uniform amounts of solder on each pad. This invention has been instrumental in improving the precision and reliability of soldering processes.

Career Highlights

Raymond E. Prime has made significant strides in his career, particularly through his work at International Business Machines Corporation (IBM). His innovative approach to soldering technology has not only led to the development of his patented nozzle assembly but has also contributed to the advancement of manufacturing techniques within the company.

Collaborations

Throughout his career, Raymond has collaborated with esteemed colleagues, including Peter G. Ledermann and Arthur L. Leerssen. These collaborations have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies in the field.

Conclusion

Raymond E. Prime's contributions to soldering technology exemplify the spirit of innovation that drives progress in the electronics industry. His patented inventions and collaborative efforts continue to influence manufacturing practices, showcasing the importance of creativity and technical expertise in engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…