Watertown, MA, United States of America

Raymond Cruz



Average Co-Inventor Count = 8.5

ph-index = 2

Forward Citations = 21(Granted Patents)


Location History:

  • Waltham, MA (US) (2004)
  • Watertown, MA (US) (2008)

Company Filing History:


Years Active: 2004-2008

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Raymond Cruz

Introduction

Raymond Cruz is a notable inventor based in Watertown, MA (US), recognized for his significant contributions to the field of electroplating. With a total of two patents to his name, Cruz has developed analytical methods that enhance the efficiency and accuracy of electroplating processes.

Latest Patents

Cruz's latest patents include innovative techniques for bath analysis. The first patent focuses on analytical methods for determining the quantity of brightener and leveler in an electroplating bath, even in the presence of other organic additives such as accelerators, brighteners, and suppressors. These methods improve the reproducibility of measuring brighteners and levelers in electroplating baths. The second patent, titled "Plating Bath Analysis," discloses methods for determining the quantity of leveler in an electroplating bath, also in the presence of various organic additives. These methods are designed to be fast, effective over a broad concentration range, and capable of real-time performance.

Career Highlights

Throughout his career, Cruz has worked with prominent companies in the industry, including Shipley Company and Rohm and Haas Electronic Materials LLC. His experience in these organizations has contributed to his expertise in electroplating and analytical methods.

Collaborations

Cruz has collaborated with notable coworkers such as Wade W Sonnenberg and Mark J Kapeckas, further enhancing his innovative work in the field.

Conclusion

Raymond Cruz's contributions to electroplating through his patents and career experiences highlight his role as an influential inventor in the industry. His work continues to impact the efficiency and accuracy of electroplating processes.

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