Wakarusa, India

Raymond C Parisi

This inventor holds 1 USPTO granted patent. Top assignee: Biomet Manufacturing Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Raymond C Parisi. Retrieved from https://idiyas.com/inventor/raymond-c-parisi-qbmjn2sp

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Raymond C. Parisi and Sensor-Enabled Stemless Orthopedic Implants.

Introduction

Raymond C. Parisi is an inventor associated with Wakarusa, Indiana, and Biomet Manufacturing Corporation. His patent work includes a sensor-equipped humeral arthroplasty system designed to integrate sensing components into a stemless orthopedic implant.

Latest Patents

Parisi is credited with 1 patent, titled “Stemless Orthopedic Implants with Sensors.” The invention describes a humeral arthroplasty system comprising a humeral head, a taper adapter, a stemless humeral anchor, and sensor circuitry. Part of the circuitry is incorporated into the humeral head, while another portion extends into the adapter socket. An electrical circuit can pass through the taper adapter to connect the circuitry, and a force sensor can be engaged by the adapter when it is seated in the socket. The humeral head may be made of ceramic material.

Career Highlights

Parisi’s listed patent reflects work on integrating sensing technology with orthopedic implant components. The design combines a stemless anchor and modular adapter with circuitry intended to support force sensing within the implant assembly.

Collaborations

Parisi is associated with Biomet Manufacturing Corporation. Kevin Miller is identified as a coworker.

Conclusion

Raymond C. Parisi’s patent describes a sensor-integrated, stemless humeral implant system that brings together orthopedic components and force-sensing circuitry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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