Company Filing History:
Years Active: 2004-2015
Title: Ray-Ting Chang: Innovator in Copper CMP Processes
Introduction
Ray-Ting Chang is a notable inventor based in Lujou, Taipei, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of copper chemical mechanical polishing (CMP) processes. With a total of 2 patents to his name, Chang's work is recognized for its innovative approaches to metal layer polishing.
Latest Patents
One of Ray-Ting Chang's latest patents is the "Barrier-slurry-free copper CMP process." This method involves several steps to polish a metal layer effectively. The process begins with providing a structure that has an upper patterned dielectric layer with an opening. A barrier layer is then formed over this patterned layer, lining the opening. Following this, a metal layer is deposited over the barrier layer, filling the opening. The process includes multiple polish steps using different slurry compositions to remove portions of the metal layer and barrier layer, ultimately exposing the underlying dielectric layer.
Career Highlights
Ray-Ting Chang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at TSMC has allowed him to develop and refine his innovative polishing techniques, contributing to advancements in semiconductor manufacturing processes.
Collaborations
Chang has collaborated with several talented individuals in his field, including Yi-Chen Chen and Ching-Ming Tsai. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Ray-Ting Chang's contributions to the semiconductor industry, particularly through his patented copper CMP processes, highlight his role as an influential inventor. His work continues to impact the efficiency and effectiveness of semiconductor manufacturing.