This inventor holds 3 USPTO granted patents. Top assignee: Texas Instruments Corporation. Active years: 1997-2014.
Company Filing History:
Years Active: 1997-2014
Title: Ray H. Purdom: Innovator in Microelectromechanical Systems
Introduction
Ray H. Purdom is a notable inventor based in Sherman, Texas. He has made significant contributions to the field of microelectromechanical systems (MEMS) with a total of 3 patents to his name. His work focuses on developing low-cost MEMS devices that enhance functionality and efficiency.
Latest Patents
Among his latest patents is the "Leadframe-based premolded package having air channel for microelectromechanical system (MEMS) device." This invention features a mass-produced carrier fabricated as a pre-molded leadframe. The design includes a two-tier stepped recess that allows for the integration of an integrated circuit chip, which can function as a pressure sensor, microphone, or speaker. The air channel design enhances the device's performance by connecting the chip opening to the ambient exterior.
Another significant patent is the "Leadframe-based premolded package having acoustic air channel for micro-electro-mechanical system." Similar to his previous work, this invention also utilizes a pre-molded leadframe and features a two-tier stepped recess. The integrated circuit chip is protected by a cover and is designed to operate effectively in various applications, including audio and pressure sensing.
Career Highlights
Ray H. Purdom is currently associated with Texas Instruments Corporation, a leading company in the semiconductor industry. His innovative work in MEMS technology has positioned him as a key contributor to advancements in this field.
Collaborations
Throughout his career, Ray has collaborated with talented individuals such as James Huckabee and Edgar R. Zuniga. These collaborations have further enriched his work and contributed to the development of cutting-edge technologies.
Conclusion
Ray H. Purdom's contributions to microelectromechanical systems exemplify his innovative spirit and dedication to advancing technology. His patents reflect a commitment to creating efficient and cost-effective solutions in the MEMS domain.
