Ranganath Teki

Title: Ranganath Teki: Innovator in Abrasive-Free Planarization Technology

Introduction

Ranganath Teki is a notable inventor based in Valatie, NY (US). He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of mask substrate technology. His innovative approach has led to advancements that enhance the precision and efficiency of manufacturing processes.

Latest Patents

Ranganath Teki holds a patent for "Abrasive-free planarization for EUV mask substrates." This patent describes a process for abrasive-free chemical mechanical planarization of silicon thin film coated EUV mask substrates. The process effectively removes bumps and pits on the substrate, thereby mitigating reflective errors in the mask. It employs a two-step polishing procedure, where the second step is abrasive-free and utilizes an amine or amine salt as the polishing agent. This innovation represents a significant step forward in improving the quality of EUV mask substrates.

Career Highlights

Throughout his career, Ranganath Teki has worked with prominent organizations such as Sematech, Inc. and Clarkson University. His experience in these institutions has allowed him to develop and refine his expertise in semiconductor technologies. His work has been instrumental in advancing the field and addressing critical challenges in mask substrate manufacturing.

Collaborations

Ranganath has collaborated with talented individuals in his field, including Suryadevara Vijayakumar Babu and Hariprasad Amanapu. These collaborations have fostered innovation and contributed to the successful development of new technologies.

Conclusion

Ranganath Teki's contributions to abrasive-free planarization technology have made a lasting impact on the semiconductor industry. His innovative patent and career achievements highlight his role as a key figure in advancing manufacturing processes. His work continues to influence the field and inspire future innovations.