Luebeck, Germany

Randy Redlich

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Nikon Slm Solutions Ag. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Randy Redlich. Retrieved from https://idiyas.com/inventor/randy-redlich

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Randy Redlich: Innovator in Additive Manufacturing

Introduction

Randy Redlich is a notable inventor based in Lübeck, Germany. He has made significant contributions to the field of additive manufacturing. His innovative approach has led to the development of a unique patent that enhances manufacturing processes.

Latest Patents

Randy holds a patent for a "Powder Container with Socket Connector for an Additive Manufacturing Process." This invention aims to improve the efficiency and effectiveness of additive manufacturing techniques. It showcases his commitment to advancing technology in this rapidly evolving industry. He has 1 patent to his name.

Career Highlights

Randy is currently employed at Nikon SLM Solutions AG, a company known for its cutting-edge solutions in the field of additive manufacturing. His role at Nikon allows him to work on innovative projects that push the boundaries of technology. His expertise and dedication have made him a valuable asset to the company.

Collaborations

Randy collaborates with talented individuals such as Philip Negendank and Sebastian Feist. Together, they work on various projects that aim to enhance the capabilities of additive manufacturing. Their teamwork exemplifies the spirit of innovation and collaboration in the industry.

Conclusion

Randy Redlich is a prominent figure in the field of additive manufacturing, with a focus on innovative solutions that improve manufacturing processes. His contributions and collaborations continue to shape the future of this technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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