Shenzhen, China

Ran Jiang

This inventor holds 2 USPTO granted patents and 2 published patent applications and 1 EPO patent. Top assignee: Huawei Technologies Co., Limited. Active years: 2015-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ran Jiang. Retrieved from https://idiyas.com/inventor/ran-jiang-6tqpsunx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2015-2025

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2 patents (USPTO):Explore Patents

Title: Innovations by Ran Jiang in Packaging Technology

Introduction

Ran Jiang is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of packaging technology, particularly in the development of advanced packaging structures and power amplifiers. With a total of 2 patents to his name, Jiang's work is recognized for its innovative approach and practical applications.

Latest Patents

Ran Jiang's latest patents include a packaging structure and a power amplifier. The first patent describes a packaging structure that consists of a first component, a second component, a printed circuit board, and a metal plate with an etched pattern. The printed circuit board is positioned on the metal plate, featuring an open slot where the first component is placed. This design allows for efficient connectivity between the components and enhances the overall functionality of the packaging structure.

The second patent focuses on a method for packaging a quad flat non-leaded (QFN) package body. This method involves etching a metal plate to create a bond wire bench, a component bench, and a bump. The process includes assembling components on the bench and packaging the metal plate to form a package body. This innovative approach allows for the stacking of large passive components, improving the reliability of welding joints and overcoming limitations in component stacking.

Career Highlights

Ran Jiang is currently employed at Huawei Technologies Co., Limited, where he continues to push the boundaries of technology through his innovative designs. His work at Huawei has positioned him as a key player in the development of cutting-edge packaging solutions.

Collaborations

Throughout his career, Jiang has collaborated with talented individuals such as Xiaomin Zhang and Kai Chen. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Ran Jiang's contributions to packaging technology exemplify the spirit of innovation and creativity. His patents reflect a deep understanding of engineering principles and a commitment to advancing the field. As he continues to work at Huawei, his future endeavors are likely to yield even more impactful inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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