Rishon-LeZion, Israel

Rami Remez

This inventor holds 1 USPTO granted patent. Top assignee: B.b.p. Technologies Ltd.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rami Remez. Retrieved from https://idiyas.com/inventor/rami-remez

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Rami Remez: Innovator in Materials Handling

Introduction

Rami Remez is a notable inventor based in Rishon-LeZion, Israel. He has made significant contributions to the field of materials handling through his innovative designs. His work focuses on improving the efficiency and functionality of pallets used in transporting flexible cargo.

Latest Patents

Rami Remez holds a patent for a Non-flat Deck-board Pallet. This invention is designed specifically for handling flexible cargo and features a unique upper deck that is not flat. The pallet can be reinforced with additional elements and includes a taut cable that helps maintain the integrity of the upper deck when loaded. This innovation addresses common challenges faced in materials handling.

Career Highlights

Rami Remez is associated with B.B.P. Technologies Ltd., where he applies his expertise in developing advanced materials handling solutions. His work has garnered attention for its practicality and effectiveness in real-world applications.

Collaborations

Rami collaborates with Shlomo Nevo, contributing to the development of innovative solutions in their field. Their partnership enhances the creative process and leads to the generation of impactful inventions.

Conclusion

Rami Remez is a dedicated inventor whose work in materials handling has led to significant advancements. His patent for the Non-flat Deck-board Pallet exemplifies his commitment to innovation and problem-solving in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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