Company Filing History:
Years Active: 2014
Title: Ramesh Bhandari: Innovator in Multilayer Printed Wiring Board Technology
Introduction
Ramesh Bhandari is a notable inventor based in Ogaki, Japan. He has made significant contributions to the field of electronics through his innovative designs and patents. His work primarily focuses on multilayer printed wiring boards, which are essential components in modern electronic devices.
Latest Patents
Ramesh Bhandari holds a patent for a multilayer printed wiring board. This invention includes a core base material with a penetrating portion, a low-thermal-expansion substrate, and various conductive elements designed for efficient electrical connections. The wiring layer features a resin insulation layer and a conductive layer, enhancing the performance and reliability of electronic circuits.
Career Highlights
Bhandari is associated with Ibiden Company Limited, where he has been instrumental in advancing technology related to printed wiring boards. His expertise in this area has led to the development of innovative solutions that meet the demands of the electronics industry.
Collaborations
Throughout his career, Ramesh has collaborated with talented individuals such as Takashi Kariya and Kazuhiro Yoshikawa. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Ramesh Bhandari's contributions to the field of multilayer printed wiring boards exemplify his dedication to innovation and technology. His work continues to influence the electronics industry, paving the way for future advancements.