Shanghai, China

Ramachandra Pai B Rajendra

This inventor holds 2 USPTO granted patents. Top assignees: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics Japan G.k.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ramachandra Pai B Rajendra. Retrieved from https://idiyas.com/inventor/ramachandra-pai-b-rajendra

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2021

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2 patents (USPTO):Explore Patents

Title: Ramachandra Pai B Rajendra: Innovator in Electrical Connectors

Introduction

Ramachandra Pai B Rajendra is a notable inventor based in Shanghai, China. He has made significant contributions to the field of electrical connectors, holding a total of 2 patents. His work has been instrumental in advancing technology in this area.

Latest Patents

Among his latest innovations is an electrical connector, which showcases his expertise and commitment to improving connectivity solutions. This invention reflects his dedication to enhancing the functionality and reliability of electrical components.

Career Highlights

Ramachandra has had a distinguished career, working with prominent companies such as Tyco Electronics (Shanghai) Co., Ltd. and Tyco Electronics Japan G.K. His experience in these organizations has allowed him to develop and refine his skills in electrical engineering and product design.

Collaborations

Throughout his career, Ramachandra has collaborated with talented individuals, including Ken Sakai and Yulin Feng. These partnerships have contributed to his success and the advancement of his projects.

Conclusion

Ramachandra Pai B Rajendra is a remarkable inventor whose work in electrical connectors has made a lasting impact in the industry. His patents and collaborations highlight his innovative spirit and dedication to technological advancement.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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