Stein, Switzerland

Ralf Müller

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Telsonic Holding Ag. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ralf Müller. Retrieved from https://idiyas.com/inventor/ralf-müller-35asdzbj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations by Ralf Müller in Ultrasonic Joining Technology

Introduction

Ralf Müller is an innovative inventor based in Stein, Switzerland. He has made significant contributions to the field of ultrasonic joining technology, particularly in the method for connecting workpieces. His work focuses on enhancing the efficiency and effectiveness of joining processes through advanced techniques.

Latest Patents

Ralf Müller holds a patent for a method for connecting workpieces, specifically an assembled object where two workpieces are joined by means of ultrasound. The patent describes a process where a workpiece with at least one energy direction sensor is brought into contact with a second workpiece. The ultrasonic vibrations are introduced into one of the workpieces via a working surface of a sonotrode. The sonotrode is designed with a contour that features contact lines on the working surface, ensuring precise positioning with respect to the first workpiece.

Career Highlights

Throughout his career, Ralf Müller has been associated with Telsonic Holding AG, a company known for its expertise in ultrasonic technology. His role at Telsonic has allowed him to develop and refine innovative methods that improve the joining of materials, making significant strides in manufacturing processes.

Conclusion

Ralf Müller’s contributions to ultrasonic joining technology exemplify the impact of innovation in modern manufacturing. His patented methods not only enhance the efficiency of workpiece connections but also pave the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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