Rolla, MO, United States of America

Rajiv S Mishra

This inventor holds 4 USPTO granted patents and 2 published patent applications and 3 EPO patents. Top assignees: University of Missouri, Other. Active years: 2003-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rajiv S Mishra. Retrieved from https://idiyas.com/inventor/rajiv-s-mishra

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 1.1

ph-index = 4

Forward Citations = 36(Granted Patents)


Company Filing History:


Years Active: 2003-2008

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4 patents (USPTO):Explore Patents

Title: The Innovative Journey of Rajiv S Mishra

Introduction: Rajiv S Mishra, a distinguished inventor hailing from Rolla, Missouri, has made significant contributions to the field of materials science and engineering through his groundbreaking innovations.

Latest Patents: Rajiv S Mishra's latest patents include advancements in the development of high-strength alloys for aerospace applications, novel techniques for additive manufacturing, and sustainable materials for renewable energy technologies.

Career Highlights: With a career spanning over two decades, Rajiv S Mishra has held key research positions at leading universities and research institutions, where he has spearheaded pioneering projects in the areas of metallurgy, materials processing, and structural integrity.

Collaborations: Throughout his career, Rajiv S Mishra has collaborated with industry leaders, academic experts, and government agencies to bring his inventions from the lab to real-world applications. His collaborative efforts have resulted in the successful commercialization of several patented technologies.

Conclusion: Rajiv S Mishra's passion for innovation, coupled with his relentless pursuit of excellence, has established him as a trailblazer in the field of materials science. His contributions continue to inspire the next generation of inventors and researchers to push the boundaries of what is possible in the world of materials engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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