Company Filing History:
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Years Active: 2018
Title: Innovations by Rajesh Mandamparambil
Introduction
Rajesh Mandamparambil is an accomplished inventor based in The Hague, Netherlands. He has made significant contributions to the field of micro-electronics, particularly through his innovative patent that addresses the challenges of bonding bare chip dies.
Latest Patents
Rajesh holds a patent titled "Method for bonding bare chip dies." This method involves the assembly of a micro-electronic component using a conductive die bonding material. The material consists of a conductive thermosettable resin or flux-based solder, along with a dynamic release layer adjacent to the die bonding material layer. A laser beam is utilized to activate the dynamic release layer, directing the conductive die bonding material towards the pad structure to be treated. This innovative approach ensures that the adhesive matter can be transferred effectively while preventing thermal overexposure that could render the adhesive ineffective.
Career Highlights
Throughout his career, Rajesh has worked with notable organizations such as the Netherlands Organization for Applied Scientific Research (TNO) and Imec Vzw. His experience in these institutions has allowed him to refine his skills and contribute to advancements in micro-electronic technologies.
Collaborations
Rajesh has collaborated with esteemed colleagues, including Edsger Constant Pieter Smits and Sandeep Menon Perinchery. These collaborations have further enriched his work and fostered innovation in the field.
Conclusion
Rajesh Mandamparambil's contributions to micro-electronics through his innovative patent demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.