The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Nov. 08, 2013
Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno, The Hague, NL;
Imec Vzw, Leuven, BE;
Edsger Constant Pieter Smits, The Hague, NL;
Sandeep Menon Perinchery, The Hague, NL;
Jeroen Van den Brand, The Hague, NL;
Rajesh Mandamparambil, The Hague, NL;
Harmannus Franciscus Maria Schoo, The Hague, NL;
Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO, The Hague, NL;
IMEC vzw, Leuven, BE;
Abstract
A method is provided for assembly of a micro-electronic component, in which a conductive die bonding material is used. This material includes a conductive thermosettable resin material or flux based solder and a dynamic release layer adjacent to the conductive thermoplastic material die bonding material layer A laser beam is impinged on the dynamic release layer, adjacent to the die bonding material layer, in such a way that the dynamic release layer is activated to direct conductive die bonding material matter towards the pad structure to be treated, to cover a selected part of the pad structure with a transferred conductive die bonding material. The laser beam is restricted in timing and energy, in such a way that the die bonding material matter remains thermosetting. Accordingly, adhesive matter can be transferred while preventing that the adhesive is rendered ineffective by thermal overexposure in the transferring process.