Raja-Sheker Bollampally

Title: Innovations of Raja-Sheker Bollampally

Introduction

Raja-Sheker Bollampally is an accomplished inventor based in Farmington Hills, MI (US). He has made significant contributions to the field of electronic component assembly through his innovative patent.

Latest Patents

Raja-Sheker Bollampally holds a patent for a flip-chip bonding method. This invention is directed towards a flip chip assembly, specifically introducing a new bonding process for attaching an electronic component to a substrate. The method involves forming solder pads on the electronic component and bond pads on the substrate, with the bond pads featuring a top layer made of metal. The process includes placing an underfill film on the bond pad, heating both the electronic component and the substrate, aligning the solder pads with the bond pads, and finally forming a bond between them.

Career Highlights

Raja-Sheker Bollampally is associated with Visteon Global Technologies, Inc., where he applies his expertise in electronic assembly technologies. His work has contributed to advancements in the efficiency and reliability of electronic components.

Collaborations

He has collaborated with notable colleagues such as Achyuta Achari and Mohan R Paruchuri, enhancing the innovative environment at Visteon Global Technologies, Inc.

Conclusion

Raja-Sheker Bollampally's contributions to the field of electronic component assembly through his patented flip-chip bonding method exemplify his innovative spirit and dedication to advancing technology. His work continues to impact the industry positively.