The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Mar. 29, 2002
Achyuta Achari, Canton, MI (US);
Mohan R. Paruchuri, Canton, MI (US);
Raja-sheker Bollampally, Farmington Hills, MI (US);
Achyuta Achari, Canton, MI (US);
Mohan R. Paruchuri, Canton, MI (US);
Raja-Sheker Bollampally, Farmington Hills, MI (US);
Visteon Global Technologies, Inc., Van Buren Township, MI (US);
Abstract
The present invention is generally directed towards a flip chip assembly. In particular a new bonding process for bonding an electronic component to the substrate is disclosed. The method comprises the steps of forming at least one solder pad on the electronic component and forming at least one bond pad on the substrate wherein the at least one bond pad has a top layer formed of a metal. Placing an underfill film on top of the at least one bond pad and heating the electronic component and the substrate. Moving the electronic component towards the substrate such that the at least one solder pad is aligned on top of the at least one bond pad and finally forming a bond between the at least one solder pad and the top layer of the at least one bond pad.