Chungcheongnam-do, South Korea

Raetaek Oh

USPTO Granted Patents = 3 

Average Co-Inventor Count = 2.3

ph-index = 1


Location History:

  • Cheonan-si, KR (2018)
  • Chungcheongnam-do, KR (2019 - 2021)

Company Filing History:


Years Active: 2018-2021

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3 patents (USPTO):Explore Patents

Title: Raetaek Oh: Innovator in Substrate Treatment Technologies

Introduction

Raetaek Oh is a prominent inventor based in Chungcheongnam-do, South Korea. He has made significant contributions to the field of substrate treatment technologies, holding a total of 3 patents. His innovative work focuses on improving the efficiency and effectiveness of substrate processing methods.

Latest Patents

Raetaek Oh's latest patents include a substrate treating apparatus and a method for measuring discharge amounts using the same. The substrate treating apparatus features a flow rate measuring unit that includes a container located outside the housing, which has an accommodation space for treatment liquid. This apparatus is designed to measure the amount of treatment liquid and includes a drain line for discharging the liquid. Additionally, he has developed a substrate treating system that incorporates an index unit, process executing unit, and buffer unit, all designed to enhance the substrate treatment process while effectively removing static electricity.

Career Highlights

Raetaek Oh is currently employed at Semes Co., Ltd., where he continues to innovate in substrate treatment technologies. His work has been instrumental in advancing the capabilities of substrate processing systems, making them more efficient and reliable.

Collaborations

Throughout his career, Raetaek Oh has collaborated with notable colleagues, including Jaeyong Kim and Taekyoub Lee. These partnerships have contributed to the development of cutting-edge technologies in the field.

Conclusion

Raetaek Oh's contributions to substrate treatment technologies exemplify his dedication to innovation and excellence. His patents and ongoing work at Semes Co., Ltd. continue to shape the future of substrate processing.

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