Rachel Eileen Dahlberg

Title: Rachel Eileen Dahlberg: Innovator in Silica-Containing Substrates

Introduction

Rachel Eileen Dahlberg is a prominent inventor based in State College, PA (US). She has made significant contributions to the field of materials science, particularly in the development of silica-containing substrates. With a total of 2 patents, her work has implications for electronic devices and manufacturing processes.

Latest Patents

Dahlberg's latest patents focus on silica-containing substrates with unique features. One patent describes substrates that include vias with a narrow waist, which are essential for electronic devices. The invention details a silica-containing substrate comprising at least 85 mol % silica, featuring a via that extends from one surface to another. The via has specific diameters at both ends, with a waist diameter that is less than the diameters at the surfaces, ensuring a ratio that enhances performance. This innovative design allows for improved functionality in electronic applications.

Career Highlights

Rachel Eileen Dahlberg is currently employed at Corning Incorporated, where she continues to push the boundaries of material innovation. Her work at Corning has positioned her as a key player in the development of advanced materials for various applications.

Collaborations

Dahlberg collaborates with talented coworkers such as Tian Huang and Yuhui Jin, contributing to a dynamic research environment that fosters innovation and creativity.

Conclusion

Rachel Eileen Dahlberg's contributions to the field of silica-containing substrates exemplify her dedication to innovation and excellence. Her patents reflect a commitment to advancing technology in electronic devices, making her a notable figure in her field.