Company Filing History:
Years Active: 2025
Title: Qwai H Low - Innovator in Microelectronic Packaging
Introduction
Qwai H Low is a notable inventor based in Cupertino, CA (US). He has made significant contributions to the field of microelectronics, particularly in the area of packaging technologies. His innovative approach has led to the development of a unique method that enhances the efficiency and functionality of microelectronic devices.
Latest Patents
Qwai H Low holds a patent for a method titled "3D-interconnect." This patent describes a process for making a microelectronic package that involves bonding a conductive structure to a carrier. The conductive structure is designed to overlie the rear surface of a microelectronic element that is positioned on the carrier. The method includes a monolithic structure with a base and multiple interconnections extending from the base toward the carrier. The microelectronic element is strategically placed between adjacent interconnections, and both the element and interconnections are encapsulated with an encapsulant. The conductive structure is also patterned to create external contacts, some of which may overlie the microelectronic element. This innovative design aims to improve the performance and reliability of microelectronic packages.
Career Highlights
Qwai H Low is currently associated with Adeia Semiconductor Technologies LLC, where he continues to push the boundaries of microelectronic packaging. His work has been instrumental in advancing the technology used in modern electronic devices. With a focus on innovation, he has dedicated his career to developing solutions that meet the evolving needs of the semiconductor industry.
Collaborations
Throughout his career, Qwai H Low has collaborated with talented professionals in the field, including Chok J Chia and Patrick Variot. These collaborations have fostered an environment of creativity and innovation, leading to the successful development of cutting-edge technologies.
Conclusion
Qwai H Low's contributions to microelectronic packaging through his patent and work at Adeia Semiconductor Technologies LLC highlight his role as a key innovator in the industry. His dedication to advancing technology continues to impact the field positively.