Morrisville, NC, United States of America

Quinn Don Martin

USPTO Granted Patents = 3 

Average Co-Inventor Count = 1.4

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2011-2019

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3 patents (USPTO):Explore Patents

Title: Quinn Don Martin: Innovator in Air Cavity Packaging Technology

Introduction

Quinn Don Martin is a notable inventor based in Morrisville, NC (US), recognized for his contributions to the field of packaging technology. He holds three patents, showcasing his innovative approach to solving complex engineering challenges. His work primarily focuses on air cavity packages, which have significant implications for the electronics industry.

Latest Patents

One of Quinn Don Martin's latest patents is centered around the concept of air cavity packages. This invention describes a leadframe and air cavity packages formed using the leadframe, allowing for the rapid formation of multiple air cavity packages simultaneously. The manufacturing method involves creating the leadframe from a strip of conductive material, which includes conductive leads and downset facets. Additionally, the process entails forming slugs from conductive material and arranging them in specific positions relative to the downset facets of the leadframe. The slugs are then fastened to the leadframe, and plastic packages are formed around both the leadframe and the slugs, resulting in air cavities that expose portions of the slugs and conductive leads.

Another aspect of his air cavity package invention allows for the easy placement and interconnection of electrical components within the packages. By repositioning several devices at once using the leadframe, the assembly process becomes more efficient. After assembly, the air cavity packages can be separated from the leadframe, and they include a slug, a plastic frame that forms an air cavity, and a cover that encloses the cavity. The conductive leads extend through the plastic frame and are exposed within the air cavity, facilitating the bonding of components secured inside.

Career Highlights

Quinn Don Martin has worked with prominent companies in the technology sector, including Macom Technology Solutions Holdings, Inc. and International Rectifier Corporation. His experience in these organizations has contributed to his expertise in developing innovative packaging solutions.

Collaborations

Throughout his career, Quinn has collaborated with talented individuals such as Sameer Singhal and Andrew B Edwards. These partnerships have likely enriched his work and fostered a collaborative environment for innovation.

Conclusion

Quinn Don Martin is a distinguished inventor whose work in air cavity packaging technology has made a significant impact in the electronics industry. His innovative patents and career achievements reflect his dedication to advancing engineering solutions.

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