The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Sep. 01, 2016
Applicant:

Macom Technology Solutions Holdings, Inc., Lowell, MA (US);

Inventor:

Quinn Don Martin, Morrisville, NC (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/047 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/047 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 23/66 (2013.01); H01L 23/49861 (2013.01);
Abstract

A leadframe and air cavity packages formed using the leadframe are described. Using the leadframe, several air cavity packages can be quickly formed at one time. Further, electrical components can be placed within and interconnected with the air cavity packages easily by repositioning several devices at a time using the leadframe. After assembly, the air cavity packages can be separated from the leadframe. The air cavity packages can include a slug, a plastic frame that surrounds the slug and forms an air cavity, and a cover that encloses the air cavity. The air cavity package further includes one or more conductive leads of the leadframe that extend through the plastic frame and are exposed within the air cavity. The conductive leads can be relied upon to bond out components secured within the air cavity. Finally, the cover can be secured to enclose the air cavity.


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