Quinn, Daniel J

Title: The Innovative Contributions of Daniel J. Quinn

Introduction

Daniel J. Quinn is a notable inventor based in Carrollton, TX (US). He has made significant contributions to the field of integrated circuits, showcasing his expertise through his innovative patent. With a focus on enhancing the functionality and efficiency of electronic components, Quinn's work stands out in the technology sector.

Latest Patents

Quinn holds a patent for a process of forming integrated circuits with contact pads in a standard configuration. This integrated circuit chip features a top layer of dielectric that is penetrated by conductive vias. These vias connect electrical contacts within the integrated circuit to a network of electrical leads situated on top of the dielectric layer. The network of leads is connected to an array of contact pads, which are designed for simultaneous solder connection to a leadframe. This innovation is crucial for improving the performance and reliability of integrated circuits.

Career Highlights

Quinn is associated with Thomson Components, a division of Mostek Corporation. His role in this company has allowed him to apply his inventive skills in a practical setting, contributing to advancements in electronic technology. His patent reflects his commitment to innovation and his ability to solve complex engineering challenges.

Collaborations

Quinn has worked alongside talented colleagues, including Wayne A. Mulholland and Robert Henry Bond. Their collaborative efforts have likely fostered an environment of creativity and innovation, leading to the development of cutting-edge technologies.

Conclusion

Daniel J. Quinn's contributions to the field of integrated circuits exemplify the impact of innovative thinking in technology. His patent and work at Thomson Components highlight his role as a key player in advancing electronic components. Through his efforts, Quinn continues to influence the future of integrated circuit design and functionality.