Philadelphia, PA, United States of America

Qudus Hamid

USPTO Granted Patents = 1 

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Innovations by Qudus Hamid in 3D Scaffold Fabrication

Introduction

Qudus Hamid is an innovative inventor based in Philadelphia, PA. He has made significant contributions to the field of 3D printing, particularly in the fabrication of scaffolds using biopolymers. His work focuses on enhancing the capabilities of precision extrusion deposition (PED) devices.

Latest Patents

Qudus Hamid holds a patent for an "Integratable assisted cooling system for precision extrusion deposition in the fabrication of 3D scaffolds." This invention relates to an integrated Assisting Cooling (AC) device, system, and method designed for use with PED devices. The AC device enables the use of biopolymers with higher melting points during the fabrication process. It cools the filament as it extrudes from the nozzle through low flow convective cooling. The AC device allows for cooling in both the positive and negative directions of motion on an XY plane. Additionally, it elevates with the material delivery chamber and facilitates scaffold fabrication at applied temperatures as high as approximately 250°C.

Career Highlights

Qudus Hamid is affiliated with Drexel University, where he continues to advance his research and development in the field of 3D printing. His work has garnered attention for its potential applications in various industries, including biomedical engineering.

Collaborations

Qudus collaborates with Wei Sun, a fellow researcher, to further explore the possibilities of their innovations in 3D scaffold fabrication.

Conclusion

Qudus Hamid's contributions to the field of 3D printing and scaffold fabrication demonstrate his commitment to innovation and research. His patented technology has the potential to revolutionize the use of biopolymers in various applications.

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