The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2015
Filed:
Sep. 23, 2011
Applicants:
Wei Sun, Cherry Hill, NJ (US);
Qudus Hamid, Philadelphia, PA (US);
Inventors:
Wei Sun, Cherry Hill, NJ (US);
Qudus Hamid, Philadelphia, PA (US);
Assignee:
Drexel University, Philadelphia, PA (US);
Primary Examiner:
Int. Cl.
CPC ...
B29C 47/88 (2006.01); B29C 35/04 (2006.01); B29C 67/00 (2006.01); B29C 35/16 (2006.01); B29C 47/00 (2006.01);
U.S. Cl.
CPC ...
B29C 47/8815 (2013.01); B29C 35/045 (2013.01); B29C 67/0055 (2013.01); B29C 2035/1658 (2013.01); B29C 47/0014 (2013.01); B29C 2035/1683 (2013.01); B29C 2947/92704 (2013.01); B29C 2947/92923 (2013.01); B29C 2947/92942 (2013.01);
Abstract
The present invention relates to an integrated Assisting Cooling (AC) device, system and method for use with PED devices, allowing use of biopolymers having higher melting points in the fabrication of 3D scaffolds. The AC device cools the filament as it is extruding from the nozzle via low flow convective cooling. The AC device allows for cooling in the +/− direction of motion on an XY plane. The AC device elevates with the material delivery chamber. The AC device allows for scaffold fabrication at applied temperatures as high as about 250° C.