This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Other. Active years: 2021.
Company Filing History:
1 out of 834,411 Years Active: 2021
Title: Innovations of Quan Ke in Flip Chip Technology
Introduction
Quan Ke is a notable inventor based in Guangdong, China. He has made significant contributions to the field of semiconductor technology, particularly in the area of flip chip encapsulation methods. His innovative approach has the potential to enhance production efficiency in the electronics industry.
Latest Patents
Quan Ke holds a patent for an encapsulation method for flip chips. This method involves electroforming metal on both the electrode surface of a flip chip and the surface of an encapsulation substrate simultaneously. The process includes several steps: setting an encapsulation substrate around the flip chip, plating a metal conducting film, coating a photoresist, aligning and photoetching an electrode structure, and electroforming metal inside the photoresist structural model. This encapsulation method simplifies the process and improves production efficiency through the use of electroforming and photoetching technology.
Career Highlights
Throughout his career, Quan Ke has focused on advancing semiconductor technologies. His work has led to the development of innovative methods that streamline production processes. His patent reflects his commitment to enhancing the efficiency and effectiveness of flip chip technology.
Collaborations
Quan Ke has collaborated with notable colleagues, including Futing Yi and Ming Pan. Their combined expertise contributes to the advancement of technology in their field.
Conclusion
Quan Ke's contributions to flip chip technology through his innovative encapsulation method demonstrate his significant role as an inventor. His work not only simplifies production processes but also enhances efficiency in the electronics industry.